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Sn96.5 / Ag3.0 / Cu0.5 (Lead-Free / RoHS Compliant) |
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217℃ - 219℃ |
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7.4 g/cm³ |
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Available from 0.05 mm to 2.0 mm |
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We offer precise custom diameter scaling (e.g., 0.55 mm) to fit your specific substrate design and pitch requirements. |
We understand that in semiconductor manufacturing, even a micron-level deviation can impact yield. KINSTREAM ensures industry-leading consistency through:
Advanced atomization technology ensures highly spherical balls with ultra-tight diameter tolerances, facilitating seamless automated placement.
Low oxide content on the surface ensures excellent wetting and reduces the risk of "voiding" during the reflow process, enhancing solderability.
Strict Lot-to-Lot Consistency
Every batch undergoes rigorous micro-structure inspection and chemical analysis to ensure uniform alloy distribution and mechanical strength.
Optimized Micro-structure
Our controlled manufacturing environment yields a refined grain structure, significantly improving the long-term reliability of solder joints under thermal stress.
KINSTREAM SAC305 solder balls are the preferred choice for high-density electronic packaging:
Providing stable electrical connections for high-pin-count components.
Enabling next-gen miniaturization for mobile, automotive, and industrial electronics.
Wafer-Level Packaging (WLP)
Supporting fine-pitch bumping for advanced chip-scale solutions.
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